SMT Hybrid Packaging 2018

Nurnberg Messe, Messezentrum, Nuremberg, Germany

SMT Hybrid Packaging 2018


SMT 2018 in Nuremberg is one of the leading international exhibitions for system integration in micro electronics. The exhibition is held annually at Messezentrum Nurnberg and the latest edition will take place between 05.06 and 07.06. With close to 500 exhibitors from 28 countries and over 15,100 visitors, SMT 2018 is considered a key event for the microelectronics industry.

During SMT of the key international conferences for system integration in micro electronics is held. Named the SMT Hybrid Packaging conference, the event covers a broad range of topics including Assembly, Components, Design and Development, EMS, PCB production, Packaging, Screen Printing, Soldering, Test Systems and many more. All trade visitors agree that during the conference the leading experts and industry movers present the latest issues, solutions and product information, ensuring the success of the planned business investments.

Book your hotel during SMT 2018 early and take advantage of the best rates and exclusive accommodation offers provided by our team. Simply fill our hotel reservation form below and you will be able to choose from the best value hotels in Nuremberg and industry leading customer support, furthering your success during the trade fair.


The SMT Hybrid Packaging 2018 edition ended on 07.06.2018. Next edition will start on 07.05.2019. Click the button below:

go to SMT Hybrid Packaging 2019